- diffusion annealing
- 扩散退火
English-Chinese metallurgy dictionary. 2014.
diffusion annealing
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diffusion annealing — podifuzinis atkaitinimas statusas T sritis radioelektronika atitikmenys: angl. diffusion annealing vok. Nachdiffusionstempern, n rus. последиффузионный отжиг, m pranc. recuit après la diffusion, m … Radioelektronikos terminų žodynas
Annealing (metallurgy) — Annealing, in metallurgy and materials science, is a heat treatment wherein a material is altered, causing changes in its properties such as strength and hardness. It is a process that produces conditions by heating to above the recrystallization … Wikipedia
recuit après la diffusion — podifuzinis atkaitinimas statusas T sritis radioelektronika atitikmenys: angl. diffusion annealing vok. Nachdiffusionstempern, n rus. последиффузионный отжиг, m pranc. recuit après la diffusion, m … Radioelektronikos terminų žodynas
Rapid Thermal Annealing — Rapid Thermal Processing (dt.: schnelle thermische Bearbeitung) ist ein Überbegriff für die Bearbeitung von Wafern in einem Hochtemperaturprozess, bei dem eine sehr rasche Erhitzung des Wafers mit Halogenlampen erzielt wird. Inhaltsverzeichnis 1… … Deutsch Wikipedia
Nachdiffusionstempern — podifuzinis atkaitinimas statusas T sritis radioelektronika atitikmenys: angl. diffusion annealing vok. Nachdiffusionstempern, n rus. последиффузионный отжиг, m pranc. recuit après la diffusion, m … Radioelektronikos terminų žodynas
podifuzinis atkaitinimas — statusas T sritis radioelektronika atitikmenys: angl. diffusion annealing vok. Nachdiffusionstempern, n rus. последиффузионный отжиг, m pranc. recuit après la diffusion, m … Radioelektronikos terminų žodynas
последиффузионный отжиг — podifuzinis atkaitinimas statusas T sritis radioelektronika atitikmenys: angl. diffusion annealing vok. Nachdiffusionstempern, n rus. последиффузионный отжиг, m pranc. recuit après la diffusion, m … Radioelektronikos terminų žodynas
steel — steellike, adj. /steel/, n. 1. any of various modified forms of iron, artificially produced, having a carbon content less than that of pig iron and more than that of wrought iron, and having qualities of hardness, elasticity, and strength varying … Universalium
Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… … Wikipedia
Monolayer doping — (MLD) is a well controlled, wafer scale surface doping technique first developed at the University of California, Berkeley, in 2007.[1] This work is aimed for attaining controlled doping of semiconductor materials with atomic accuracy, especially … Wikipedia
Brazing — This article is about the metal joining process. For the cooking technique, see braising. Brazing practice Brazing is a metal joining process whereby a filler metal is heated above and distributed between two or more close fitting parts by… … Wikipedia
